Senior AI/ML Engineer
Siemens Digital Industries Software is a global leader in Electronic Design Automation (EDA) software, hardware, and design solutions. We partner with the world’s leading producers of semiconductor microelectronic circuits and systems, enabling them to design and produce cutting-edge electronic products faster and more efficiently.
We are looking for a Senior AI/ML Engineer to join our Central Engineering Solutions team.
Your primary responsibility will be to collaborate with a team of experienced professionals and SMEs to understand customer needs and deliver comprehensive, end-to-end workflow solutions for advanced 2.5D and 3D System-in-Package (SiP) designs. These multi-domain workflows integrate Siemens’ industry-leading EDA and MCAD tools, enabling architectural planning, physical design and verification, multi-die-based electrical, thermal, and mechanical stress analysis, as well as manufacturing testing for advanced SiP designs.
Responsibilities:
- Design, implement, maintain, test, and document software modules and subsystems, with a strong focus on AI/ML applications.
- Develop scalable, customized, and automated workflows using Python, Tcl/Tk, Bash, and related tools—emphasizing seamless AI/ML integration.
- Apply problem-solving skills to identify and resolve AI/ML-related design, tool, or flow issues.
- Enhance design flows and methodologies for advanced technology nodes.
- Integrate and optimize AI/ML-driven workflows for SI/PI analysis, extraction, 3DBlox, 3DStack, and multiphysics simulations (thermal, mechanical, electrical) for 3D-IC.
- Collaborate with CAD, 3D/2.5D packaging, and physical implementation teams to define and refine workflow requirements.
- Support the development and adoption of 3DBlox and standards-based solutions for 3D-IC/3DStack architectures.
- Manage design data and EDA infrastructure, including tool installation, environment setup (Linux/Windows), compute resource monitoring, backups, and troubleshooting.
Qualifications:
- Bachelor’s or Master’s degree with +5 years of experience in software development and CAD/design.
- Strong programming experience in C++, Python, Tcl/Tk, and Shell/Bash, with deep expertise in Python for AI/ML use cases.
- Solid understanding of data structures, software design, and development in both Windows and Linux environments, particularly for large-scale data processing.
- Hands-on experience with Flow Managers/MakeFiles for building complex design structures and workflows.
- Proven experience integrating AI/ML/LLM technologies into EDA or 3D-IC workflows, focusing on data-driven automation.
- Demonstrated success using AI/ML/LLM techniques for Design Space Exploration or Design Optimization (e.g., floorplanning, placement, thermal/power optimization, or performance tuning).
- Strong background in design data management and EDA infrastructure setup, including system administration, compute environment configuration, and resource management.
- Understanding of ASIC design methodologies from RTL synthesis to physical implementation and Netlist-to-GDS flow.
- Familiarity with version control systems (e.g., Git) and Agile/Scrum development practices.
- Awareness of 2.5D and 3D packaging solutions (e.g., TSMC InFO, CoWoS, GF GF32, ASE FoCUS, Amkor SWIFT, Samsung MDI).
- Excellent communication skills in English, with the ability to collaborate effectively with globally distributed teams.
Preferred Qualifications:
- Experience with AI/ML frameworks such as TensorFlow, PyTorch, or scikit-learn.
- Background in data science, machine learning engineering, or computational intelligence.
- Familiarity with cloud computing platforms (AWS, Azure, GCP) for scalable AI/ML deployment.
- Experience with Siemens Calibre DRC, LVS, and/or 3DSTACK solutions.
- Exposure to AI-driven 3DBlox and 3DStack technologies development or integration.
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