Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.

Overview:

Siemens EDA is expanding its Innovator 3DIC portfolio and advanced packaging capabilities. We are seeking a Senior Product Manager (m/f/d) to lead product strategy and execution for EBS packaging products. This role will drive roadmap alignment, customer engagement, and integration across multi-die, interposer, and substrate design workflows.

Key Responsibilities:

• Own product vision and roadmap for EBS packaging solutions, ensuring alignment with Siemens’ Innovator 3DIC strategy.
• Define and prioritize features for products to support advanced IC packaging, heterogeneous integration, and 3Dblox standards.
• Collaborate with R&D, UX, and engineering teams to deliver intuitive, AI-infused workflows for complex substrate and interposer design.
• Engage with foundry partners, ecosystem vendors, and strategic customers to validate requirements and workflows.
• Support go-to-market activities, including messaging, positioning, and enablement for sales and field teams.
• Monitor competitive landscape and emerging technologies in 3DIC packaging and system-level integration.
• Represent Siemens in industry consortia and standards bodies (e.g., 3Dblox, OCP).

Required Skills & Qualifications:

• Proven experience in IC packaging design flows, EDA tools, and advanced packaging technologies.
• Strong understanding of multi-die integration, interposer/substrate design, and system-level co-design.
• Familiarity with Xpedition tool suite
• Ability to translate complex technical requirements into actionable product strategies.
• Excellent communication and leadership skills for cross-functional collaboration.
• BS/MS in Electrical Engineering or related field; experience in semiconductor packaging or EDA strongly preferred.

Preferred:

• Experience with foundry workflows, 3Dblox standards, and heterogeneous integration.

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Working at Siemens Software

Why us?

We look forward to your application! Please use only our career platform, which you can access via "Apply now".

Send us an email to careers-DACH.sisw@siemens.com, if you would like to clarify initial questions with our recruiting team. Contact person for this job advertisement is  Dominik Strumidel – dominik.strumidel@siemens.com

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We value equal opportunities and welcome applications from people with disabilities. At Siemens, we believe people who’ve had real experiences dealing with being different will excel as leaders. Let's foster a culture of creativity and innovation. We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment. Please contact us to request accommodation.

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