Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.

Your primary responsibility is to secure technical design wins for Siemens EDA's product and service offerings. Specifically, you will drive technical wins for industry-leading Siemens 3D-IC solutions, including Innovator3D Integrator and Layout, alongside the Calibre family of 3DIC solutions (Calibre 3DSTACK, Calibre 3DThermal, Calibre 3DPERC, and Calibre 3DStress).

In this role, you will deliver technical presentations, conduct product demonstrations and benchmarks, and help develop solutions and account strategies to gain market share. Your territory coverage consists of Key Accounts located primarily (but not limited to) Japan. You will integrate with global peers and communicate status updates to various collaborators and influential customers. International travel is required.

Qualifications

Required:

• Education & Experience: BSEE or MSEE with 4-year demonstrated ability in the semiconductor field.
• Data Formats: Knowledge of IC and packaging data formats (e.g., Verilog, LEF/DEF, GDS, OASIS, ODB++).
• Industry Knowledge: Familiarity with 2.5D-IC and 3D-IC integration technology offerings (e.g., TSMC 3DFabric, Intel EMIB/Foveros).
• Technical Concepts: General understanding of Chiplet-based design challenges and methodologies.
• Scripting & OS: Solid scripting skills (Python, Tcl, Perl, or similar) and solid understanding of both Windows and Linux operating systems.
• Efficiency Tools: Proficiency with Microsoft Word, Excel, and PowerPoint.
• Languages: professional working proficiency in Japanese and English.
• Travel: Willingness to travel to Japan for onsite customer meetings and support several times per year, as well as general domestic and international travel.

応募資格

必須要件

■ 学歴・経験

• 電気電子工学系の学士号（BSEE）または修士号（MSEE）を有し、半導体業界で4年以上の実務経験をお持ちの方

■ データフォーマットに関する知識

• ICおよびパッケージング関連のデータフォーマットに関する知識
• Verilog
• LEF/DEF
• GDS
• OASIS
• ODB++ など

■ 業界知識

• 2.5D-ICおよび3D-IC統合技術に関する知識
• TSMC 3DFabric
• Intel EMIB/Foveros
• その他関連技術

■ 技術的知識

• Chipletベース設計における課題や設計手法に関する一般的な理解

■ スクリプト・OS

• 以下いずれかのスクリプト言語による実務レベルのスキル
• Python
• Tcl
• Perl
• または同等の言語
• WindowsおよびLinuxオペレーティングシステムに関する実務知識

■ 業務アプリケーション

• Microsoft Word、Excel、PowerPoint の使用スキル

■ 語学力

• 日本語および英語によるビジネスレベルのコミュニケーション能力

■ 出張対応

• 年に数回、日本国内での顧客訪問・サポートのための出張が可能であること
• 国内外を含む一般的な出張に対応できること

Preferred

• Prior experience in a customer-facing role.
• Familiarity with 2.5D/3D-IC EDA cockpit solutions (e.g., Siemens Innovator3D IC Integrator, Cadence Integrity SystemPlanner, Synopsys 3DIC Compiler).
• Familiarity with IC package/interposer layout implementation methodologies and EDA tools (e.g., Cadence APD).
• Direct experience with Siemens Calibre solutions (Calibre DRC/LVS and/or Calibre 3DSTACK).

• Possess a passion to learn and perform at the groundbreaking of technology. 
• Have a desire to broaden exposure to the business aspects of the technical design world. 
• Enjoy chipping in to the success of a distributed team while being able to work independently with minimal direction. 
• Effectively influences collaborators at any level.
• Build rapid rapport and credibility with customer organizations while maintaining a strong internal network of company contacts.

• 最先端技術を学び続け、活用していくことに情熱を持っている方
• 技術設計の世界だけでなく、ビジネス面にも視野を広げたい方
• グローバルチームの成功に貢献しながら、自律的に業務を遂行できる方
• あらゆる階層のステークホルダーに対して効果的に影響力を発揮できる方
• 顧客組織との信頼関係を迅速に構築しつつ、社内ネットワークも強固に維持できる方