Siemens Digital Industries Software is a global technology powerhouse. With some of the best-known brands in the world, Siemens has stood for engineering excellence, innovation, quality, and reliability for more than 175 years.

We are looking for a Software Engineer to join our CES-3DIC team in Cairo, Egypt. As a Software Engineer, you will contribute to the development of innovative software products and comprehensive workflow solutions for advanced 2.5D and 3D System-in-Package (SiP) designs. Your work will involve integrating Siemens’ industry-leading EDA and MCAD tools to facilitate architectural planning, physical design and verification, multi-die analysis (electrical, thermal, and mechanical stress), and manufacturing test, making a significant impact on the future of chip design.

Responsibilities:

• Perform moderately complex development activities, including the design, implementation, maintenance, testing, and documentation of software modules and subsystems for physical design, place-and-route, and 3D packaging.
• Develop scalable and customized solutions, streamline and automate workflows, and deploy robust production code using Python, Tcl/Tk, Bash, and other scripting tools and languages focused on physical implementation and packaging.
• Apply strong problem-solving skills to identify complex physical design, packaging, tool, or workflow issues and facilitate their resolution.
• Improve physical design and packaging flows and methodologies for advanced technology nodes, with a focus on performance, power, and area (PPA) optimization.
• Support the integration and enhancement of flows related to floorplanning, placement, routing, power integrity, signal integrity, and physical verification for 3D ICs and advanced packaging.
• Collaborate with CAD, 3D/2.5D packaging, and physical implementation teams to address workflow requirements and drive innovation in place-and-route and packaging solutions.
• Contribute to the development and integration of 3DBlox-, 3DStack-, and industry standards-based solutions relevant to 3D IC/3DStack architectures and advanced packaging.
• Manage design data and EDA infrastructure related to physical design and packaging, including tool installation and maintenance, server environment setup (Linux/Windows), resource monitoring, and troubleshooting.

Required Skills:

• Bachelor’s degree with 4+ years of experience, or a Master’s degree with 2+ years of experience, in Computer Science, Computer Engineering, Electrical Engineering, or a closely related technical field.
• Strong scripting skills in Python, Tcl/Tk, and Shell/Bash.
• Strong understanding and hands-on experience with software data structures and software development in Windows and Linux environments.
• Prior experience with flow managers and Makefiles for building complex design structures and workflows.
• Proficiency in design data management and EDA infrastructure, including organizing large-scale design data, installing and upgrading EDA tools, and managing server environments.
• Deep understanding of ASIC physical design methodologies, from RTL synthesis through physical implementation (floorplanning, placement, routing, CTS, timing closure, and physical verification), including expertise in the netlist-to-GDS flow.
• Familiarity with version control systems (e.g., Git) and software development methodologies (e.g., Agile and Scrum).
• Ability to work both independently and collaboratively within a team with minimal supervision.
• Advanced English speaking and writing skills for effective communication within global teams.

Preferred Skills:

• Hands-on experience with industry-leading place-and-route tools (e.g., Cadence Innovus, Synopsys Fusion Compiler/ICC2, Siemens Aprisa) and physical verification tools (e.g., Siemens Calibre DRC, LVS, and PEX).
• Familiarity with package design tools (e.g., Cadence APD/SiP and Siemens Xpedition) and package/interposer planning solutions (e.g., Siemens Innovator 3D IC, Cadence Integrity/Innovus, and Synopsys 3DIC Compiler).
• Experience with 3D IC/3DStack solutions and related physical implementation challenges.
• Familiarity with IC analysis tools such as Siemens HyperLynx, Ansys HFSS and RedHawk, Cadence Voltus, or Synopsys PrimeTime for signal and power integrity analysis in physical design.
• Knowledge of advanced process nodes (e.g., FinFET technologies) and their impact on physical design.

We’re Siemens. A collection of over 377,000 minds building the future, one day at a time in over 200 countries. We're dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit and business need. Bring your curiosity and creativity and help us shape tomorrow!

We offer a comprehensive reward package which includes a competitive basic salary, bonus scheme and generous holiday allowance.

Siemens is an equal opportunities employer and do not discriminate unlawfully on any grounds. We are committed to providing access and equal opportunity.

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