Siemens EDA is a global technology leader in Electronic Design Automation (EDA) software, dedicated to pushing the boundaries of semiconductor design. As a Software Engineer, you will contribute to developing innovative software products and comprehensive workflow solutions for advanced 2.5D and 3D System-in-Package (SIP) designs. Your work will involve integrating Siemens’ industry-leading EDA and MCAD tools to facilitate architectural planning, physical design/verification, multi-die analysis (electrical, thermal, mechanical stress), and manufacturing test, making a significant impact on the future of chip design.

Responsibilities:

• Drive the integration and seamless workflow between physical design and 3D-IC planning tools for complex, multi-die advanced packaging designs.
• Develop, document, and champion methodologies for constructing chiplet designs within physical implementation environments and effectively integrating them into 3D-IC planning platforms.
• Create and integrate substrate/package designs using advanced package layout tools, ensuring smooth transfer and assembly within 3D-IC planning environments.
• Perform complex 3D assembly of chiplets and packages within 3D-IC planning tools and execute comprehensive verification to ensure LVS (Layout Versus Schematic) and DRC (Design Rule Check) cleanliness.
• Develop robust scripts and automation solutions using Python, Tcl/Tk, Bash, or similar languages to enhance design efficiency, streamline workflows, and improve tool interoperability.
• Act as a technical expert, providing guidance, support, and best practices to internal teams and potentially key customers. This includes understanding user needs, demonstrating solutions, and contributing to technical documentation.
• Diagnose and resolve complex technical issues related to tool integration, advanced packaging methodologies, and verification challenges.
• Keep abreast of the latest advancements in advanced packaging, 3D-IC technologies, and explore the application of Artificial Intelligence (AI) to optimize design flows and verification processes.

Required Skills:

• Master’s degree in electrical engineering, Computer Engineering, or a closely related technical field with 5+ years of relevant industry experience.
• Demonstrated hands-on expertise with advanced packaging design tools, including a strong working knowledge of building 3D packages.
• Proficiency in scripting and software development using Python, Tcl/Tk, Bash, or similar languages for automation and workflow customization.
• Strong understanding of advanced packaging design principles and methodologies.
• Experience with industry-leading physical implementation/Place & Route tools and 3D-IC planning/integration tools.
• Working knowledge of advanced package layout design tools (e.g., for substrate/package design).
• Familiarity with 3D verification tools for LVS and DRC in 3D-IC environments.
• Strong problem-solving abilities and a proactive approach to identifying and resolving technical challenges.
• Excellent communication skills, both written and verbal, with the ability to articulate complex technical concepts to diverse audiences.
• Ability to work independently and collaboratively in a fast-paced, dynamic environment.

Preferred Skills:

• Direct experience with Package Design tools (e.g., Cadence APD/SiP, Siemens Xpedition) and Package / Interposer planning solutions (e.g., Siemens Innovator 3D IC, Cadence Integrity/Innovus, Synopsys 3DIC Compiler).
• Familiarity with the application of Artificial Intelligence (AI) in EDA workflows, particularly in areas like design optimization, verification, or methodology development.
• Knowledge of advanced process nodes and their implications for advanced packaging.
• Familiarity with IC analysis tools such as Siemens HyperLynx, Ansys HFSS and Redhawk, Cadence Voltus, or Synopsys PrimeTime for signal and power integrity analysis in physical design.
• Understanding of multi-physics analysis relevant to advanced packaging, including signal integrity (SI), power integrity (PI), DC drop analysis, thermal analysis, and thermo-mechanical stress analysis.
• Experience with version control systems (e.g., Perforce/P4, Git), product lifecycle/data management (PLM/IPLM) systems and agile development methodologies.