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Applications Engineer, 3D-IC Solutions Sales Japan

Job ID
503458
發布時間
21-四月-2026
組織
Digital Industries
工作領域
Sales
公司
Siemens Electronic Design Automation Japan K.K.
經驗等級
高級專業人士
工作职位
全職
工作模式
僅辦公室/ 工地
工作性質
長期
地點
  • 東京 - 東京都 - 日本
Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.

Key Responsibilities：
  • As an Applications Engineer at Siemens EDA, your primary responsibility is to secure technical design wins for Siemens EDA's product and service offerings. Specifically, you will be responsible for technical wins with the industry leading solutions Innovator3D Integrator and Layout, and the Calibre family of 3DIC solutions (3DStack, 3DThermal, 3DPERC, 3DStress). Tessent 3D DFT and Aprisa 3DIC are also part of the overall solution portfolio. 
  • Responsible activities will include delivery of technical presentations, conducting product demonstrations and benchmarks, and participation in development of solutions and account strategies leading to market share gains for Siemens.  
  • This position also offers the opportunity to help architect and prototype Siemens EDA’s emerging 3DIC solution through the development of flows and integration scripts to link various Siemens tools into a larger 3DIC solution.
  • Your territory coverage consists of Key Accounts located but not limited to Japan.  Account coverage is not limited to Japan, you will be responsible for integrating with peers located all over the world, communicating essential status to a variety of stakeholders and influential customers.  International travel may be required.

職務内容：
• お客様の3DIC PKG設計・製造プロセスにおける課題をヒアリングし、Siemens EDA（Electronic Design Automation）ツールを活用した最適なソリューションを提案。
• 3DIC PKG設計フロー（配置配線、熱・電源・信号完全性解析、寄生抽出、DRC/LVSなど）に関する技術的なコンサルテーションおよびサポート。
• お客様への製品デモンストレーション、トレーニング、および技術資料の作成。
• お客様の設計データを用いたベンチマークテストの実施と結果分析。
• 営業チームと連携し、技術的側面からのプリセールス活動を推進。
• 製品開発チームへの市場ニーズやお客様からのフィードバック提供。


Qualifications：                                                                                                                                                   
  • MSEE/BSEE with 4+ years design experience. Experience in advanced IC and/or interposer design, experience with IC Packaging design is a plus.  
  • Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS, etc.) is required.
  • Familiarity with Package / Interposer planning solutions (Siemens Innovator3D IC Integrator, Cadence SystemPlanner, Synopsys 3DIC Compiler, Excel) is preferred.
  • Familiarity with Package Design (Cadence APD/SiP, Siemens Xpedition) is desired.
  • Practical experience with IC P&R tools for Silicon Interposer design is a highly desired.
  • Experience with one or more of the following tools: Aprisa, Olympus-SoC, Synopsys (IC Compiler, Physical Compiler, Fusion Compiler Custom Compiler) and Cadence (SoC Encounter, Innovus, Virtuoso) preferred.
  • Understanding of ASIC design methodology from RTL Synthesis to Physical Implementation phases; Netlist-to-GDS flow expertise obtained through benchmark, evaluation or production (tape-out) of complex ASIC designs is a plus.
  • Familiarity with 2.5D and 3D solutions (TSMC InFO, CoWoS-S, CoWoS-R, CoWoS-L, GF GF32, ASE FoCUS, Amkor SWIFT, Samsung MDI, etc., Intel EMIB/EMIB_T, Foveros).
  • Familiarity with Chiplet based design methodologies.
  • Experience with Siemens Calibre DRC, LVS, and/or 3DSTACK solutions is a highly desirable.
  • Familiarity with IC analysis tools such as m{Power, Ansys HFSS and Redhawk, Cadence Voltus, or Synopsys PrimeTime is a plus.
  • Above average competency with Microsoft Word, Excel, and PowerPoint.
  • Scripting/Programming:  Python, Tcl, Perl, or similar languages.
  • Working OS knowledge of Windows and Linux.
  • Prior experience as an Applications Engineer is preferred.
  • Strong written and verbal English and Japanese language communication skills

応募資格（必須）：

  • 半導体パッケージング技術に関する深い専門知識（5年以上の実務経験）
    • 3DIC、2.5D IC、SiP（System-in-Package）などの先進パッケージング技術に関する理解。
    • TSV（Through-Silicon Via）、インターポーザ、RDL（Redistribution Layer）、マイクロバンプなどの構造および製造プロセスに関する知識。
  • EDAツール使用経験
    • 半導体パッケージング設計、解析、検証に関するEDAツールの使用経験（Mentor Graphics/Siemens EDA製品の経験があれば尚可）。
    • 特に、配置配線ツール、寄生抽出ツール、熱解析ツール、電源・信号完全性解析ツール、DRC/LVSツールなどの実務経験。
  • 回路設計、レイアウト設計、または物理検証の経験
    • IC設計フローにおけるバックエンドプロセスに関する理解と経験。
  • 顧客対応能力
    • お客様の技術的な課題を正確に理解し、論理的かつ明確に説明・提案できるコミュニケーション能力。
    • プレゼンテーション能力、ドキュメンテーション能力。
  • プログラミングスキル
    • Tcl、Perl、Pythonなどのスクリプト言語を用いたEDAツール環境のカスタマイズや自動化経験（あれば尚可）。
  • 語学力
    • ビジネスレベルの日本語能力。
    • 技術文書の読解や海外チームとの連携に必要となる英語力。


The ideal candidate will:
  • Possess a passion to learn and perform at the cutting edge of technology.
  • Have a desire to broaden exposure to the business aspects of the technical design world.
  • Enjoy contributing to the success of a great team.
  • Be able to work independently with minimal supervision.
  • Effectively influence people at any level.
  • Enjoy helping and motivating others to be successful.
  • Demonstrated ability to build strong rapport and credibility with customer organizations while maintaining a company internal network of contacts.
  • Have the capability to work independently with minimal direction and supervision.
  • Be willing to travel domestically and internationally.

We are an equal opportunity employer and value diversity at our company. We do not discriminate based on race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status.

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