Siemens Digital Industries Software is a global leader in Electronic Design Automation (EDA) software, hardware, and design solutions. We partner with the world’s leading producers of semiconductor microelectronic circuits and systems, enabling them to design and produce cutting-edge electronic products faster and more efficiently.

We are looking for a Senior Software Development Engineer to join our Central Engineering Solutions team.

Your primary responsibility will be to collaborate with a team of experienced professionals and subject matter experts to understand customer requirements and deliver comprehensive, end-to-end workflow solutions that support the design and development of advanced 2.5D and 3D System-in-Package (SiP) technologies. These multi-domain workflows seamlessly integrate Siemens’ industry-leading EDA and MCAD tools to enable architectural planning, physical design and verification, multi-die electrical, thermal, and mechanical stress analysis, as well as manufacturing testing for next-generation SiP designs.

Responsibilities:

• Perform moderately complex development activities, including the design, implementation, maintenance, testing, and documentation of software modules and subsystems for SI/PI/IR analysis.
• Develop scalable, customized, and automated solutions; streamline workflows; and deploy robust production code using Python, Tcl/Tk, Bash, and other scripting languages.
• Apply strong problem-solving skills to identify and resolve design, tool, or workflow issues.
• Enhance design flows and methodologies for advanced technology nodes.
• Support the integration and optimization of flows related to SI/PI analysis, extraction, 3DBlox, and 3DStack for 3D-IC.
• Collaborate with CAD, 3D/2.5D packaging, and physical implementation teams to define and meet workflow requirements.
• Contribute to the development and integration of 3DBlox and standards-based solutions for 3D-IC/3DStack architectures.
• Manage design data and EDA infrastructure—including installing and maintaining EDA tools, setting up Linux and Windows environments, monitoring compute resources, managing disk space and backups, coordinating with IT on resource allocation, and resolving infrastructure issues.

Qualifications:

• Bachelor’s or Master’s degree in Electrical or Computer Engineering with 5+ years of experience in software development and CAD/design.
• Strong programming skills in C++, Python, Tcl/Tk, and Shell/Bash.
• Solid understanding of software data structures and hands-on experience developing in Windows and Linux environments.
• Experience with Flow Managers/MakeFiles for building complex design structures and workflows.
• Proficiency in design data management and EDA infrastructure setup, including large-scale data handling, tool installation, server maintenance, resource monitoring, and issue resolution.
• Ability to independently set up and maintain compute environments, including hardware/software configuration, user and license management, and troubleshooting.
• Understanding of ASIC design methodology from RTL synthesis through physical implementation, including Netlist-to-GDS flow experience in benchmarks, evaluations, or tape-outs.
• Familiarity with version control systems (e.g., Git) and Agile/Scrum development practices.
• Awareness of 2.5D and 3D packaging solutions (e.g., TSMC InFO, CoWoS, GF GF32, ASE FoCUS, Amkor SWIFT, Samsung MDI).

Preferred Qualifications:

• Familiarity with package design tools (e.g., Cadence APD/SiP, Siemens Xpedition).
• Experience with package/interposer planning solutions (e.g., Siemens Innovator 3D IC, Cadence Integrity/Innovus, Synopsys 3DIC Compiler).
• Exposure to IC analysis tools such as Siemens HyperLynx, Ansys HFSS/RedHawk, Cadence Voltus, or Synopsys PrimeTime.
• Experience in Signal Integrity/Power Integrity (SI/PI) analysis and extraction flows for advanced packaging.
• Hands-on involvement in developing, integrating, or supporting 3DBlox and 3DStack technologies, as well as related industry standards.
• Background in multiphysics simulation and troubleshooting workflow or tool-related issues in 3D-IC/SiP environments.

We’re Siemens. A collection of over 377,000 minds building the future, one day at a time in over 200 countries. We're dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit and business need. Bring your curiosity and creativity and help us shape tomorrow!

Siemens is an equal opportunities employer and do not discriminate unlawfully on any grounds. We are committed to providing access and equal opportunity.